Artificial intelligence (AI) is no longer a research concept — it is the economic engine driving infrastructure investment worldwide. The growth of AI data centers, powered by high-performance CPUs, ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

Fabric might be the last thing on your mind when firefighters rescue someone from a burning building, but without fire-resistant clothing, such rescues might not happen at all. The turnout gear that ...

Discover how heat resistant materials and material science innovations help electronics manufacturing manage rising temperatures, boost reliability, and enable smaller, more powerful next‑generation ...

Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...

Thanks to MSC Software you can now download a free thermal simulation tool, PICLS Lite, via the Electronics Weekly website. It could represent a saving of hundreds of pounds, and means anyone can ...

Dublin, July 07, 2025 (GLOBE NEWSWIRE) -- The "Global Market for Thermal Management Systems and Materials for Advanced Semiconductor Packaging 2026-2036" report has been added to ...

ANRA Technologies, a global leader in uncrewed traffic management and operational solutions, today announced a significant enhancement to its U-space services. By integrating advanced simulation and ...