Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
Abstract: In this article, a twofold physical model (PM) embedded 3-D U-Net with polarization fusion (PF), referred to as PUP-Net, is proposed for solving 3-D inverse scattering problems (ISPs) with a ...
Developers are navigating confusing gaps between expectation and reality. So are the rest of us. Depending who you ask, AI-powered coding is either giving software developers an unprecedented ...
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